LGA1851 and LGA1700 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer, thanks to even CPU contact surface
NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chipset design of Ryzen processors - 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area, such as voltage converters
INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, which means that only one visible cable is connected to the motherboard
LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers on the M.2_1 slot can lead to compatibility problems. An overview and solution is available on the manufacturer's website and in the manual.
Extend Multiple RGB LED fans and LED Strips Flexible 58 cm or 22.83 inches in Length for Cable Routing 5-pin and 4-pin RGB Header Compatibility Both 4-pin RGB Header and...
Suitable for CPU, chipsets on Mainboard, VGA card, etc Easy to use Zif Socket Templates ensure correct applying area with various CPU socket types Produces an even layer when using...
WELL PROVEN QUALITY: The design of our thermal paste packagings has changed several times, the formula of the composition has remained unchanged, so our MX pastes have stood for high...
EXTREMELY high thermal conductivity of 12.5KW achieved with even smaller particles, is perfect for even the most demanding configurations and can also be used in industrial cooling systems THERMAL...