LGA1851 and LGA1700 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer, thanks to even CPU contact surface
NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chipset design of Ryzen processors - 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area, such as voltage converters
INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, which means that only one visible cable is connected to the motherboard
LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers on the M.2_1 slot can lead to compatibility problems. An overview and solution is available on the manufacturer's website and in the manual.
Never-fray stitched edges for durability Micro-woven surface for maximum control Optimized for both optical and laser sensors Durable and washable for easy cleaning Natural non-slip rubber base Dimensions 450 mm...
RF Wireless Connection 12,000 dpi Optical Hero Sensor Six Programmable Buttons 1000Hz Polling Rate 1ms Response Time Up to 250 Hours of Battery Life Onboard Memory Mac, Windows, & Chrome...
Immersive, 7.1 Surround Sound for Positional Audio: Outfitted with custom-tuned 50 mm drivers, capable of software-enabled surround sound (only available on Windows 10 64-bit) Triforce Titanium 50mm High-End Sound Drivers:...
EXTREMELY high thermal conductivity of 12.5KW achieved with even smaller particles, is perfect for even the most demanding configurations and can also be used in industrial cooling systems THERMAL...
WELL PROVEN QUALITY: The design of our thermal paste packagings has changed several times, the formula of the composition has remained unchanged, so our MX pastes have stood for high...
